International
With the ever-progressing development and downsizing it is crucial to effectively dissipate heat from electronic components which are generate significant amounts of heat. Failure to effectively ...
DiaTherm™ podložky sú skonštruované z inovatívnej a pokrokovejsilikónovej gumy s vysokou tepelnou vodivosťou a výnimočnou elektrickoupevnosťou. Vyrábajú sa v hrúbkach 0,5 až 12 ...
DOWSIL TC-3065 is a one-part, 6.5W/mk thermal conductivity silicone gel.
DOWSIL TC-4040 is a two-part, 1-to-1 mix ratio, blue color, thermally conductive dispensable thermal pad.
DOWSIL™ TC-4515 Thermally Conductive Gap Filler is a soft and compressible material once cured, designed to dissipate the heat from electronics mounted on printed circuit board to heat sink ...
DOWSIL TC-4525 is a 2.5 W/m·K Silicone Gap Filler material for automotive applications, it is a two part room temperature curing material. APPLICATIONS DOWSIL™ TC-4525 Thermally ...
DOWSIL TC-4535 CV Thermally Conductive Gap Filler is a soft and compressible material once cured, designed to dissipate the heat from PCB module assemblies mounted on printed circuit board to heat ...
DOWSIL TC-5150 Thermally Conductive Gap Filler is a high performance, one-part, non- curable, dispensable thermally conductive gap filler with 5 W/mK thermal conductivity, and like other Dow ...
DOWSIL TC-5550 Thermal Conductive Compound is a high thermal conductivity (5.0W/mk), low thermal resistance (0.04 °C-cm2/W), low BLT(0.02mm) thermal grease that is especially designed for bare ...
ER2074 is a flame retardant, thermally conductive, two part potting and encapsulating compound. The flame retardant technology used is of a ‘clean’ type leading to relatively low toxicity fumes ...
ER2183 is a flame retardant, thermally conductive, two part potting and encapsulating compound.The flame retardant technology used is of a ‘clean’ type leading to relatively low toxicity fumes ...
HTC (Heat Transfer Compound) neobsahuje silikón a nie je elektrický vodič, vďaka tomu má vysokú odolnosť, nevytvára elektrický oblúk ani mechanické opotrebenie. Pri použití tejto hmoty ...
Electrolube’s Non-Silicone Heat Transfer Compound Aerosol is aninnovative new way of applying our standard HTC. The aerosol versionoffers greater ease of use, allowing a thin, even film of HTC ...
Teplovodivá pasta
HTCPX provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil. The exceptional properties obtained from HTCPX are due to the novel use of various ...
HTCPX-LV provides the ultimate in thermal conductivity together with the advantage of a relatively lowviscosity, making it suitable for a range of application methods. The exceptional properties ...
Electrolube HTCX is an enhanced version of HTC featuring improved thermal conductivity, lower oil bleed, and lower evaporation weight loss. HTCX is recommended where the efficient and reliable ...
Silicone Heat Transfer Compound is a metal oxide filled silicone oil providing an extremely efficient and exceptionally thermally conductive compound which will operate over a wide temperature range. ...
HTSP provides the ultimate in thermal conductivity together with the very wide temperature range obtained by using silicone base oils. The exceptional properties obtained from HTSP are due to the ...
Thermal Bonding Compound is a two part epoxy bonding system which utilises metal oxides to provide excellent thermalconductivity whilst being electrically insulating. It is especially useful in the ...
Electrolube TCOR is a single component, 100% solids, low odour RTV which cures upon exposure to atmospheric moisture. The product offers a high degree of thermal conductivity and is suitable for use ...