Thermal Bonding Compound is a two part epoxy bonding system which utilises metal oxides to provide excellent thermal
conductivity whilst being electrically insulating. It is especially useful in the manufacture of heat sink assemblies where
‘piggy back’ arrangements are applied and where the manufacture design of heat sinks does not allow for welding or
brazing techniques to be employed due to complexity or geometry of the fins. TBS is also ideal for use as a bonding
medium in surface mounting assemblies.
Features- Very good thermal conductivity.
- Excellent electrical insulation characteristics.
- Solvent free system ensures no 'honeycomb' effect on curing.
- Unique filling system ensures that, after curing, mating surfaces cannot come into contact thus ensuring no
electrical leakage through the bond.
- Extremely thin curing coating of approx. 200 microns.
- Ideal as bonding medium for surface mounting assemblies.
- Components operate at thermal equilibrium thus ensuring uniform performance throughout the temperature
range.
- Bonds wide range of surfaces including dissimilar metals, epoxies, acrylics, poly-carbonates, etc.
- Remains flexible until cured and any minor adjustments required can be effected.
- Room temperature curing.
