DOWSIL TC-5150 Thermally Conductive Gap Filler is a high performance, one-part, non- curable, dispensable thermally conductive gap filler with 5 W/mK thermal conductivity, and like other Dow thermally conductive compounds, is made with silicone materials heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity and high temperature stability.
The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical device to the heat sink or chassis, thereby increasing the overall efficiency of the device.
Applications:- On board chargers
- Central processing units (CPUs)
- Memory and power modules
- Telecom base stations
- Automotive Electronic Control Units (ECU)
- Processors & Microprocessors
- Power Electronics
- Power supplies and semiconductors
Benefits:- High thermal conductivity
- Easy to dispense
- Form-in-place
- No additional curing process required
- Low thermal impedance
- Reworkable
- Room temperature storage
