DOWSIL TC-4535 CV Thermally Conductive Gap Filler

Ste tu: Produkty> Mazivá, Lepidlá, Zalievacie hmoty, Silikóny, Tmely> Chemické prípravky pre elektrotechniku> Teplo-odvádzacie hmoty> DOWSIL TC-4535 CV Thermally Conductive Gap Filler

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DOWSIL TC-4535 CV THERMALLY CONDUCTIVE GAP FILLER

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DOWSIL TC-4535 CV Thermally Conductive Gap Filler is a soft and compressible material once cured, designed to dissipate the heat from PCB module assemblies mounted on printed circuit board to heat sink providing a reliable cooling solution for modules like an engine or transmission control unit.

Features/Properties:

• 3.5 W/m.K Silicone Gap Filler
• Room temperature cure or heat accelerated cure
• Long term performance stability during temperature cycling up to 150°C
• Holds vertical position in the assembly for long service period
• Controlled silicone volatility
• UL 94 V pending

Pdf:

• TDS DOWSIL TC 4535 CV Thermally Conductive Gap Filler eng.pdf