DOWSIL TC-4515 Thermally Conductive Gap Filler

Ste tu: Produkty> Mazivá, Lepidlá, Zalievacie hmoty, Silikóny, Tmely> Chemické prípravky pre elektrotechniku> Teplo-odvádzacie hmoty> DOWSIL TC-4515 Thermally Conductive Gap Filler

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DOWSIL TC-4515 THERMALLY CONDUCTIVE GAP FILLER

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DOWSIL™ TC-4515 Thermally Conductive Gap Filler is a soft and compressible material once cured, designed to dissipate the heat from electronics mounted on printed circuit board to heat sink providing a reliable cooling solution for modules like an engine or transmission control unit. This material is specifically designed for a smooth assembly process line integration ideally suited for automated dispensing with meter mix equipment.

FEATURES & BENEFITS

• Thermal conductivity: > 1.8 W/m.K
• Room temperature cure or heat accelerated cure
• Long term performance stability during temperature cycling up to 150ºC
• Holds vertical position (cured or uncured state)
• UL 94 V-0 and CTI ≥ 600 certifications
• Glass Beads option (180 & 250 micron)

Pdf:

• TDS DOWSIL TC 4515 Thermally Conductive Gap Filler eng.pdf