DOWSIL TC-5550 Thermal Conductive Compound wins 2023 BIG INNOVATION Award

The new DOWSIL TC-5550 Thermal Conductive Compound is designed for high performance processors (central processing units, discrete graphics processing units, field programmable gate arrays, and application-specific integrated circuit chips) that sometimes have to adopt a bare die architecture for better heat dissipation. When traditional thermal greases are used, these materials typically experience pump-out, an increase in thermal resistance caused by the loss of grease from the interface. DOWSIL TC5550 Thermal Conductive Compound avoids pump-out and prints easily onto heatsinks like a traditional thermal grease. Moreover, Dow’s new solution contains no added solvents or processing aids to ensure reproducible properties over the product’s shelf life. This material also delivers performance stability that can withstand extended power cycling without pump-out for comparable performance to phase change materials (PCMs).

Dow’s award-winning DOWSIL TC-5550 Thermal Conductive Compound is a highly reliable thermal and printable grease for enhanced cooling and low pump-out performance designed for bare-die and lidless microprocessor packages. DOWSIL TC 5550 Thermal Conductive Compound combines ease-of-application with excellent pump-out stability that meets high-performance targets for next-generation electronics technology.

For further product details please visit: https://www.ulbrich-group.com/dowsil-tc-5550-thermal-conductive-compound