DOW CORNING Q3-3636 | Nové

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DOW CORNING Q3-3636 | Nové

18.09.2017

2-component, Room Temperature Curing Thixotropic Adhesive

Applications – Dow Corning Q3-3636 has been developed to provide durable adhesive sealing of components which must perform in difficult environments:
The substrates to be bonded exhibit different thermal expansion rates Designed to operate at high temperatures
Low fogging characteristics of the adhesive are desired 
Fast cure requirements make one part adhesives inappropriate.

Base:
Appearance: White paste

Viscosity [mPa.s]: 200000
Specific gravity: 1.31

Catalyst:
Grey / Black / Special Black

Viscosity [mPA.s]: 18000 - 48000 / 55000 - 135000 / 350000
Specific gravity: 1.00 / 1.02 / 1.04

Base + Catalyst
Grey / Black / Special Black

Working time [min]: 3-10 / 3-10 / 2.5-10
Tack free time [min]: 5-18 / 6-20 / 5-18
Specific gravity: 1.27 / 1.27 / 1.28
Durometer [Shore A]: 32 / 35 / 35
Tensile strength [MPa]: >1.8 / >1.8 / >1.8
Elongation [%]: >300 / >300 / >300

DOW CORNING Q3-3636

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