Special ‘spray flux’ for circuit board wave soldering WEEE/RoHS conformant DIN EN 61190-1-1: IEC RE/L0, or type 1.2.3.A under ISO 9454
‘GSP-2533/RX/OVAP’ is universally suitable for PCB wave soldering and complies with specification DIN-EN 29454/1.2.3.A. Accordingly it contains organic, halogen-free activating additives and synthetic rosins in a combination specially tuned to the thermal requirements of the soldering process.
‘GSP-2533/RXOVAP’ cannot be applied by foaming. The product has been optimized for spray flux application. ‘GSP-2533/RX/OVAP’ is sufficiently stable to retain its activity throughout the soldering process, so that the PCBs separate cleanly from the solder wave.
- Appearance: Transparent liquid
- Solid content: 2.5%
- Density (20 °C): 0,794 (+/- 0,003) g/ml
- Acid value: 22,0 - 25,0 mg KOH/g
- Activator: Dicarbonic acids
- Solvent: Alcohol mixture
- Flash point:ca. 12 °C
